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MIKROE is proud to collaborate with CEVA, a leading licensor of wireless connectivity and smart sensing technologies. CEVA's innovative sensor fusion solutions are designed to meet the demanding requirements of modern embedded applications, offering compact, efficient, and reliable components for a wide range of devices.
MIKROE Click Boards™ Featuring CEVA Technology
Our range of CEVA-powered Click boards™ enhances the sensor capabilities of your embedded designs. These modules are fully compatible with the mikroBUS™ interface, ensuring easy integration and rapid prototyping.
Sensors
CEVA's sensor fusion solutions include high-precision 6-axis and 9-axis IMUs, ideal for applications requiring accurate motion tracking and orientation detection. These components are suitable for a variety of devices, including wearables, robotics, and augmented reality systems. By integrating CEVA's sensor fusion solutions into your designs, you can ensure efficient data processing and enhanced user experiences.
Why Choose MIKROE + CEVA?
Explore all MIKROE Click boards™ featuring CEVA technology and bring advanced sensor capabilities to your embedded projects.
Smart DOF 4 Click is a compact add-on board for high-precision motion tracking and contextual sensing. This board features the BNO085, a 9-axis IMU System in Package (SiP) from CEVA, combining an accelerometer, gyroscope, and geomagnetic sensor with a 32-bit microcontroller running CEVA's SH-2 firmware. The board provides real-time, calibrated 3D...
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